Applications
The waterproof solder end cap is composed of a colored glass bead, a square copper wire tower, a solder ring, a hot melt adhesive ring, and a heat shrinkable sleeve, which is used for the sealing connection of multiple wire ends. It uniquely combines waterproof, wire clip fixing and soldered multi-strand end sealing connection
Characteristics Soldered connection Electrical insulation Sealed for strain relief Simple installation | Operating temperature range Operating temperature: -40℃~125℃ Minimum shrink temperature: 150℃ Fully recovery temperature: 175℃ Starting temperature of solder melt: 138℃ Minimum fully recovery temperature: 160℃ |
Technical Indicators
Operating Temperature | -40℃~+125℃ |
voltage Resistant | 600V |
Protection type | IP67 |
Volume Resistivity (Ω cm): | ≥1013 |
Dielectric Strength (KV/mm) | 2.0 |
Product specifications
Part No. |
Ball | Product Dimensions | Copper Cross Section | Bundle Diameter | ||||
L±3.5 | ΦA | B | Min(CMA) | Max(CMA) | ΦD | M±1 | ||
SST-SR01 | Green | 38.3 | 3.6 +0.4/-0.2 | 26.0±2.0 | 0.7(1400) | 2.4(4800) | 3.3 | 15.0 |
SST-SR02 | Red | 37.7 | 5.0 +0.7/-0.2 | 23.5±2.0 | 2.0(4000) | 4.0(8000) | 4.5 | 15.0 |
SST-SR03 | Blue | 45.5 | 7.5 +0.9/-0.2 | 26.5±2.0 | 3.5(7000) | 8.0(16000) | 7.0 | 15.0 |
SST-SR04 | Yellow | 45.0 | 9.4 +0.9/-0.3 | 25.5±3.0 | 7.5(15000) | 12.0(24000) | 9.0 | 15.0 |